creat by art - glass passivated junction chip - ideal for automated placement - fast switching for high efficiency - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 part no. with suffix "h" means aec-q101 qualified packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 2 whisker test symbol unit v rrm v v rms v v dc v i f(av) a i f =1.0a i f =1.5a t j =25c t j =100c t rr ns r ja c/w t j c t stg c document number: ds_d0000075 version: c15 maximum instantaneous forward voltage (note 1) 1.3 1.4 maximum reverse current @ rated v r do-214ac (sma) 200 400 280 400 600 420 600 storage temperature range - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a byg20d byg20g byg20j 200 140 typical thermal resistance 100 operating junction temperature range - 55 to +150 pulse energy in avalanche mode, non repetitive (inductive load switch off ), l=120mh e rsm 20 mj maximum reverse recovery time (note 2) 75 v f v i r 1 a 10 maximum average forward rectified current 1.5 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 30 a maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage weight: 0.064 g (approximately) maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanical data case: do-214ac (sma) polarity: indicated by cathode band byg20d - byg20j 1.5a, 200v - 600v hi g h efficient surface mount rectifiers features moisture sensitivity level: level 1, per j-std-020 taiwan semiconductor
(t a =25c unless otherwise noted) document number: ds_d0000075 version: c15 g r3 h part no. preferred part no. 7,500 / 13" plastic reel h note 1: "x" defines voltage from 200v (byg20d) to 600v (byg20j) part no. suffix packing code suffix packing code description ratings and characteristics curves part no. part no. suffix packing code packing code suffix package packing 1,800 / 7" plastic reel 7,500 / 13" paper reel 7,500 / 13" plastic reel BYG20DHR3G byg20d aec-q101 qualified green compound example f4 folded sma f3 folded sma f2 folded sma 1,800 / 7" plastic reel 7,500 / 13" paper reel byg20x (note 1) r3 g sma r2 sma m2 sma byg20d - byg20j taiwan semiconductor ordering information 0 0.5 1 1.5 2 0 20406080100120140160 average forward current (a) lead temperature ( o c) fig.1 forward current derating curve resistive or inductive load 0 10 20 30 40 50 60 70 1 10 100 peak forward surge urrent (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine wave 0.001 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 2 typical reverse characteristics t j =25 c t j =125 c 0.1 1 10 0.4 0.6 0.8 1 1.2 1.4 1.6 instantaneous forward current (a) forward voltage (v) fig. 4 typical forward characteristics
min max min max a 1.27 1.58 0.050 0.062 b 4.06 4.60 0.160 0.181 c 2.29 2.83 0.090 0.111 d 1.99 2.50 0.078 0.098 e 0.90 1.41 0.035 0.056 f 4.95 5.33 0.195 0.210 g 0.10 0.20 0.004 0.008 h 0.15 0.31 0.006 0.012 p/n = specific device code g = green compound yw = date code f = factory code document number: ds_d0000075 version: c15 marking diagram byg20d - byg20j taiwan semiconductor d 2.41 0.095 e 5.45 0.215 b 1.52 0.060 c 3.93 0.155 symbol unit (mm) unit (inch) a 1.68 0.066 package outline dimensions do-214ac (sma) dim. unit (mm) unit (inch) suggested pad layout 0 25 50 75 100 125 150 175 0.1 1 10 100 1000 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d0000075 version: c15 byg20d - byg20j taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
|
